{"id":39741,"date":"2022-07-29T11:33:06","date_gmt":"2022-07-29T09:33:06","guid":{"rendered":"\/elettronica\/?page_id=39741"},"modified":"2022-07-29T11:39:40","modified_gmt":"2022-07-29T09:39:40","slug":"activities-2022","status":"publish","type":"page","link":"\/elettronica\/en\/activities-2022\/","title":{"rendered":"Activities 2022"},"content":{"rendered":"\n<h3 style=\"text-align: center\">Some activities of the Bologna 2022 Electronics Center<\/h3>\n<p>\u00a0<\/p>\n<p>\u00a0<\/p>\n<p><img loading=\"lazy\" decoding=\"async\" class=\"aligncenter wp-image-39640 size-full\" title=\"Wire bonding tests on ASIC\" src=\"\/elettronica\/wp-content\/uploads\/sites\/14\/2022\/07\/Prove-di-wire-bonding-su-ASIC.jpg\" alt=\"Wire bonding tests on ASIC\" width=\"300\" height=\"200\" \/><\/p>\n<p style=\"text-align: center\"><span style=\"color: #007bb3\">&#8220;Wire bonding tests on ASIC<\/span><\/p>\n<hr \/>\n<p><img loading=\"lazy\" decoding=\"async\" class=\"aligncenter wp-image-39641 size-full\" title=\"Test with the vacuum chamber of the Section of the PRT2 boards for Limadou-2\" src=\"\/elettronica\/wp-content\/uploads\/sites\/14\/2022\/07\/Test-con-la-camera-a-vuoto-della-Sezione-delle-schede-PRT2-per-Limadou-2.jpg\" alt=\"Test with the vacuum chamber of the Section of the PRT2 boards for Limadou-2\" width=\"300\" height=\"200\" \/><\/p>\n<p style=\"text-align: center\"><span style=\"color: #007bb3\">Test with the vacuum chamber of the Section of the PRT2 boards for Limadou-2<\/span><\/p>\n<hr \/>\n<p><img loading=\"lazy\" decoding=\"async\" class=\"aligncenter wp-image-39642 size-full\" title=\"Firmware development for MD1 + MD2 chip readout for ARCADIA\" src=\"\/elettronica\/wp-content\/uploads\/sites\/14\/2022\/07\/Sviluppo-firmware-per-il-readout-dei-chip-MD1MD2-per-ARCADIA.jpg\" alt=\"Firmware development for MD1 + MD2 chip readout for ARCADIA\" width=\"300\" height=\"200\" \/><\/p>\n<p style=\"text-align: center\"><span style=\"color: #007bb3\">Firmware development for MD1 + MD2 chip readout for ARCADIA<\/span><\/p>\n<p style=\"text-align: center\">\u00a0<\/p>\n<hr \/>\n<p><img loading=\"lazy\" decoding=\"async\" class=\"aligncenter wp-image-39644 size-full\" title=\"Upgrade of the connections of the tracer previously made for the Nessie experiment\" src=\"\/elettronica\/wp-content\/uploads\/sites\/14\/2022\/07\/Upgrade-delle-connessioni-del-tracciatore-precedentemente-realizzato-per-lesperimento-Nessie.jpg\" alt=\"Upgrade of the connections of the tracer previously made for the Nessie experiment\" width=\"300\" height=\"200\" \/><\/p>\n<p style=\"text-align: center\"><span style=\"color: #007bb3\">Upgrade of the connections of the tracer previously made for the Nessie experiment<\/span><\/p>\n<p style=\"text-align: center\">\u00a0<\/p>\n<hr \/>\n<p><img loading=\"lazy\" decoding=\"async\" class=\"aligncenter wp-image-39646 size-full\" title=\"Production of the SND_SIPM60 board and installation for SND @ LHC\" src=\"\/elettronica\/wp-content\/uploads\/sites\/14\/2022\/07\/Produzione-della-scheda-SND_SIPM60-e-installazione-per-SND@LHC.jpg\" alt=\"Production of the SND_SIPM60 board and installation for SND @ LHC\" width=\"300\" height=\"200\" \/><\/p>\n<p style=\"text-align: center\"><span style=\"color: #007bb3\">Production of the SND_SIPM60 board and installation for SND @ LHC<\/span><\/p>\n<p style=\"text-align: center\">\u00a0<\/p>\n<hr \/>\n<p><img loading=\"lazy\" decoding=\"async\" class=\"aligncenter wp-image-39649 size-full\" title=\"Support for the integration and testing of the WWRS Base Module for ARCA-KM3\" src=\"\/elettronica\/wp-content\/uploads\/sites\/14\/2022\/07\/Supporto-per-lintegrazione-e-i-test-del-WWRS-Base-Module-per-ARCA-KM3.jpg\" alt=\"Support for the integration and testing of the WWRS Base Module for ARCA-KM3\" width=\"300\" height=\"200\" \/><\/p>\n<p style=\"text-align: center\"><span style=\"color: #007bb3\">Support for the integration and testing of the WWRS Base Module for ARCA-KM3<\/span><\/p>\n<p style=\"text-align: center\">\u00a0<\/p>\n<hr \/>\n<p>\u00a0<\/p>\n<p><img loading=\"lazy\" decoding=\"async\" class=\"aligncenter wp-image-39673 size-full\" title=\"Participation in the working group for the design and verification of the Arcadia-MD3 chip in LFoundry 110 nm technology\" src=\"\/elettronica\/wp-content\/uploads\/sites\/14\/2022\/07\/Partecipazione-al-working-group-per-la-progettazione-verifica-del-chip-Arcadia-MD3-in-tecnologia-LFoundry-110-nm-02.jpg\" alt=\"Participation in the working group for the design and verification of the Arcadia-MD3 chip in LFoundry 110 nm technology\" width=\"300\" height=\"200\" \/><\/p>\n<p style=\"text-align: center\"><span style=\"color: #007bb3\">Participation in the working group for the design and verification of the Arcadia-MD3 chip in LFoundry 110 nm technology <\/span><\/p>\n<p style=\"text-align: center\">\u00a0<\/p>\n<hr \/>\n<p><img loading=\"lazy\" decoding=\"async\" class=\"aligncenter wp-image-39676 size-full\" title=\"Development of a custom ASIC for \u03bcRWELL detector in 65 or 130 nm\" src=\"\/elettronica\/wp-content\/uploads\/sites\/14\/2022\/07\/Sviluppo-di-un-ASIC-custom-per-detector-\u03bcRWELL-in-65-o-130-nm-01-1.jpg\" alt=\"Development of a custom ASIC for \u03bcRWELL detector in 65 or 130 nm\" width=\"300\" height=\"200\" \/><\/p>\n<p><img loading=\"lazy\" decoding=\"async\" class=\"aligncenter wp-image-39677 size-full\" title=\"Development of a custom ASIC for \u03bcRWELL detector in 65 or 130 nm\" src=\"\/elettronica\/wp-content\/uploads\/sites\/14\/2022\/07\/Sviluppo-di-un-ASIC-custom-per-detector-\u03bcRWELL-in-65-o-130-nm-02.jpg\" alt=\"Development of a custom ASIC for \u03bcRWELL detector in 65 or 130 nm\" width=\"300\" height=\"200\" \/><\/p>\n<p style=\"text-align: center\"><span style=\"color: #007bb3\">Development of a custom ASIC for \u03bcRWELL detector in 65 or 130 nm<\/span><\/p>\n<p style=\"text-align: center\">\u00a0<\/p>\n<hr \/>\n<p><img loading=\"lazy\" decoding=\"async\" class=\"aligncenter wp-image-39680 size-full\" title=\"Microelettronica - Virtuoso schematic editor\" src=\"\/elettronica\/wp-content\/uploads\/sites\/14\/2022\/07\/Microelettronica-Virtuoso-schematic-editor.jpg\" alt=\"Microelettronica - Virtuoso schematic editor\" width=\"300\" height=\"200\" \/><\/p>\n<p style=\"text-align: center\"><span style=\"color: #007bb3\">Microelettronica &#8211; Virtuoso schematic editor<\/span><\/p>\n<p><img loading=\"lazy\" decoding=\"async\" class=\"aligncenter wp-image-39682 size-full\" title=\"Microelettronica - Virtuoso Simulator - Spectre\" src=\"\/elettronica\/wp-content\/uploads\/sites\/14\/2022\/07\/Microelettronica-Virtuoso-Simulator-Spectre.jpg\" alt=\"Microelettronica - Virtuoso Simulator - Spectre\" width=\"300\" height=\"200\" \/><\/p>\n<p style=\"text-align: center\"><span style=\"color: #007bb3\">Microelettronica &#8211; Virtuoso Simulator &#8211; Spectre<\/span><\/p>\n<p><img loading=\"lazy\" decoding=\"async\" class=\"aligncenter wp-image-39684 size-full\" title=\"Microelettronica - Virtuoso Layout Suite\" src=\"\/elettronica\/wp-content\/uploads\/sites\/14\/2022\/07\/Microelettronica-Virtuoso-Layout-Suite.jpg\" alt=\"Microelettronica - Virtuoso Layout Suite\" width=\"300\" height=\"200\" \/><\/p>\n<p style=\"text-align: center\"><span style=\"color: #007bb3\">Virtuoso Layout Suite<\/span><\/p>\n<p style=\"text-align: center\">\u00a0<\/p>\n<hr \/>\n<p>\u00a0<\/p>\n","protected":false},"excerpt":{"rendered":"<p>Some activities of the Bologna 2022 Electronics Center \u00a0 \u00a0 &#8220;Wire bonding tests on ASIC Test with the vacuum chamber of the Section of the PRT2 boards for Limadou-2 Firmware development for MD1 + MD2 chip readout for ARCADIA \u00a0 Upgrade of the connections of the tracer previously made for the Nessie experiment \u00a0 Production [&hellip;]<\/p>\n","protected":false},"author":28,"featured_media":0,"parent":0,"menu_order":0,"comment_status":"closed","ping_status":"closed","template":"template-page-builder-no-sidebar.php","meta":{"_lmt_disableupdate":"no","_lmt_disable":"","footnotes":""},"class_list":["post-39741","page","type-page","status-publish","hentry"],"_links":{"self":[{"href":"\/elettronica\/wp-json\/wp\/v2\/pages\/39741","targetHints":{"allow":["GET"]}}],"collection":[{"href":"\/elettronica\/wp-json\/wp\/v2\/pages"}],"about":[{"href":"\/elettronica\/wp-json\/wp\/v2\/types\/page"}],"author":[{"embeddable":true,"href":"\/elettronica\/wp-json\/wp\/v2\/users\/28"}],"replies":[{"embeddable":true,"href":"\/elettronica\/wp-json\/wp\/v2\/comments?post=39741"}],"version-history":[{"count":2,"href":"\/elettronica\/wp-json\/wp\/v2\/pages\/39741\/revisions"}],"predecessor-version":[{"id":39744,"href":"\/elettronica\/wp-json\/wp\/v2\/pages\/39741\/revisions\/39744"}],"wp:attachment":[{"href":"\/elettronica\/wp-json\/wp\/v2\/media?parent=39741"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}