{"id":39936,"date":"2023-08-04T10:00:07","date_gmt":"2023-08-04T08:00:07","guid":{"rendered":"\/elettronica\/?page_id=39936"},"modified":"2023-08-04T10:15:42","modified_gmt":"2023-08-04T08:15:42","slug":"activity-report-2023","status":"publish","type":"page","link":"\/elettronica\/en\/activity-report-2023\/","title":{"rendered":"Activity report 2023"},"content":{"rendered":"\n

Report of the activities of the Bologna Electronics Center presented to the Section assembly – July 2023<\/h1>\n

\u00a0<\/p>\n

Details of activities for Group I<\/span><\/h4>\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n
ATLAS\u00a0<\/td>\nPreparation of additional bases for LUCID photomultipliers \u2013 Avoni<\/td>\n<\/tr>\n
ATLAS\u00a0<\/td>\nPreparation of low and high voltage multipolar cabling, 35 meters long, for interconnection between the control\/acquisition rack and the ATLAS-AFP test-bed detector at CERN \u2013 Avoni<\/td>\n<\/tr>\n
ATLAS\u00a0<\/td>\nMounting heatsinks on the FPGAs of the ATLAS-ZDC and ATLAS LUCID LUCROD boards.\u00a0\u2013 Avoni<\/td>\n<\/tr>\n
ATLAS\u00a0<\/td>\nSupport activities for the preparation of the various test-beams of the Forward Detectors \u2013 Avoni<\/td>\n<\/tr>\n
ATLAS\u00a0<\/td>\nPreparation, assembly and testing of new brightness detectors (named ATLAS BMA) based on bonded LGAD.\u00a0\u2013 Avoni<\/td>\n<\/tr>\n
ATLAS\u00a0<\/td>\nSupport to the acquisition system based on ROD cards for PIXEL and IBL detectors \u2013 Balbi\u00a0<\/td>\n<\/tr>\n
ATLAS\u00a0<\/td>\nBakelite plate resistivity measurement system for the RPC\u00a0 detector \u2013 Meneghini<\/td>\n<\/tr>\n
ATLAS\u00a0<\/td>\nHardware support to the Lucrod card of the Lucid i detector \u2013 Meneghin<\/td>\n<\/tr>\n
ATLAS\u00a0<\/td>\nHardware support and firmware development for the Lucrod board of the ZDC\u00a0 detector \u2013 Meneghini<\/td>\n<\/tr>\n
ATLAS\u00a0<\/td>\nRealization of the wiring diagram for the prototype of the new version of the Lucrod board for the Lucid\u00a0 detector \u2013 Meneghini<\/td>\n<\/tr>\n
ATLAS\u00a0<\/td>\nProduction of 5 LV_Cutoff boards called LV_Breaker for ITK \u2013 Torromeo<\/td>\n<\/tr>\n
ATLAS\u00a0<\/td>\nRealization of 3 additional HV_Switch_box boards for ITK \u2013 Torromeo<\/td>\n<\/tr>\n
ATLAS\u00a0<\/td>\nModification of the ITK LV_Breaker boards with replacement of part of the relays with SSR (State Solid Relays) \u2013 Torromeo<\/td>\n<\/tr>\n
ATLAS\u00a0<\/td>\nAdaptation of the ITK_ATLAS patch card for connections to various sensors via SHT_Extended_Flex \u2013 Torromeo<\/td>\n<\/tr>\n
ATLAS\u00a0<\/td>\nWiring and testing, in a clean room, of the LV_breaker, HV_Switch Box and Patch ITK_ATLAS boards with the sensors for the ITK test system \u2013 Torromeo<\/td>\n<\/tr>\n
ATLAS\u00a0<\/td>\nPCB Mounting Components with Sensors for ITK Test Setup -Veri<\/td>\n<\/tr>\n
CMS\u00a0<\/td>\nLayout design, production and assembly of the electronic board \u201cCMS \u2013 NIM to LVDS & TTL Interface Rev001\u201d.\u00a0Mastropasqua, \u2013 Zuffa<\/td>\n<\/tr>\n
CMS\u00a0<\/td>\nLayout design of the electronic board \u201cCMS \u2013 DC\/DC Converter\u201d \u2013 Mastropasqua, \u2013 Zuffa<\/td>\n<\/tr>\n
CMS\u00a0<\/td>\nDesign, assembly and test of the second version of the NIM \u2013 TTL \u2013 LVDS signal conversion board.\u00a0\u2013 Mastropasqua, Zuffa<\/td>\n<\/tr>\n
LHCB\u00a0<\/td>\nFirmware development for the acquisition system of the Plume \u2013 Balbi luminometer<\/td>\n<\/tr>\n
LUXE<\/td>\nLayout design of the “Sensor PCB V3” boards hosting the sapphire sensor on which the GBP detector of the experiment is based \u2013 Zuffa<\/td>\n<\/tr>\n
LUXE<\/td>\nDesign of the \u201cSensor PCB V3 \u2013 Test Board\u201d for testing the PCBs hosting the sapphire sensors of the experiment \u2013 \u200b\u200bZuffa<\/td>\n<\/tr>\n
LUXE<\/td>\nAssembly of components on pcb cod \u201dSensor PCB V3 Rev001\u201d and \u201dSensor PCB Test Board Rev001\u201d \u2013 Zuffa<\/td>\n<\/tr>\n
LUXE<\/td>\nLayout design and production of the \u201cFERS Carrier Board REV001\u201d and \u201cTransition Board REV001\u201d electronic boards for testing the sensors of the GBP detector of the experiment \u2013 \u200b\u200bZuffa<\/td>\n<\/tr>\n
LUXE<\/td>\nLayout design of the \u201cLUXE \u2013 FERS Patch Panel Rev001\u201d electronic board for the management of all the signals coming from the sensors of the experiment detectors \u2013 Zuffa<\/td>\n<\/tr>\n
LUXE<\/td>\nLayout design of the “Transition Board REV002” electronic board for signal sorting on FFC (Flexible Flat Cable) cables of the experiment \u2013 \u200b\u200bZuffa<\/td>\n<\/tr>\n
SEE\u00a0<\/td>\nSupport to the acquisition system for beam tests and participation in the Balbi, Falchieri, Mastropasqua, Travaglini test of July ’22<\/td>\n<\/tr>\n
RD_FCC\u00a0<\/td>\nSupport to the test system of a microRWELL Mastropasqua chamber, Torromeo<\/td>\n<\/tr>\n
SND@CERN\u00a0<\/td>\nDesign and production of SND_FLEX flexible rigid board, for flexible connection between frontend SiPM board and acquisition board \u2013 Baldanza<\/td>\n<\/tr>\n
SND@CERN\u00a0<\/td>\n\n

SND@CERN Design and production of rigid flex board revision SND_FLEX2 \u2013 Baldanza<\/p>\n<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n


Details of activities for Group II<\/span><\/h4>\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n
AND<\/td>\nConstruction of a Michelson interferometer for teaching and dissemination Lolli, Degli Esposti, \u2013 Travaglini<\/td>\n<\/tr>\n
ETIC\u00a0<\/td>\nSupport for the creation of the laboratory: planning, market surveys, orders \u2013 Balbi, Mastropasqua, Torromeo, Travaglini<\/td>\n<\/tr>\n
KM3NeT\u00a0<\/td>\nControl system via wifi of the Octopaes board of the Km3 experiment.\u00a0\u2013 Of the exhibits<\/td>\n<\/tr>\n
KM3NeT\u00a0<\/td>\nFirmware validation system of the CLB board of the Km3 experiment \u2013 Degli Esposti<\/td>\n<\/tr>\n
KM3NeT\u00a0<\/td>\nRewiring of all channels of the tracer of the Nessie experiment through the creation of PCBs \u2013 Degli Esposti<\/td>\n<\/tr>\n
KM3NeT\u00a0<\/td>\nPatch board to inhibit the RS485 driver inside the Base Modules for the Instrumentation Base \u2013 Pellegrini<\/td>\n<\/tr>\n
KM3NeT\u00a0<\/td>\nDesign of the fourth generation of FMC board \u2013 Pellegrini<\/td>\n<\/tr>\n
KM3NeT\u00a0<\/td>\nSupport for the creation of the first basic module with Wet White Rabbit Switch technology: creation of wiring and assistance\/shifts at the production site in Caserta \u2013 Pellegrini<\/td>\n<\/tr>\n
KM3NET4RR<\/td>\n\u00a0Support for the creation of the laboratory: design, market surveys, orders – Degli Esposti, Pellegrini<\/td>\n<\/tr>\n
LIMADOU2\u00a0<\/td>\nAssembly and test of the HEPD-2 detector at the laboratories of Rome 2 (Tor Vergata) \u2013 Lolli<\/td>\n<\/tr>\n
NU@FNAL<\/td>\n\u00a0Production of the mezzanine boards that will house the SiPM arrays that will have to operate in liquid nitrogen for the DUNE experiment tests;\u00a0validation of the cards produced for the LAr imaging test.\u00a0\u2013 Lax<\/td>\n<\/tr>\n
NU@FNAL<\/td>\nProduction of the Motherboard boards, with ALCOR ASIC chips, which will be placed inside the liquid nitrogen container for testing the SiPM matrices for the DUNE experiment.\u00a0On each board there is the bonding of 8 ASIC Chips to manage a total of 256 SiPM \u2013 Lax<\/td>\n<\/tr>\n
NU@FNAL<\/td>\nDesign, production and test of 20 cold side boards, version 2, which will house the SiPMs and will have to operate in liquid nitrogen for the production tests of the DUNE \u2013 Lax experiment<\/td>\n<\/tr>\n
NU@FNAL<\/td>\nProduction and Test of 270 two-channel Front-end boards for the SIPM test system of the DUNE experiment \u2013 Lax\u00a0<\/td>\n<\/tr>\n
NU@FNAL<\/td>\nDesign and production of 120 channels Relay boards for the mass test of the SiPMs of the DUNE experiment with Arduino control to realize the IV characteristics of the 120 SiPMs connected to the board.\u00a0\u2013 Lax<\/td>\n<\/tr>\n
NU@FNAL<\/td>\nDesign and production of an adapter for testing cold SAMTEC cables and connectors \u2013 Lax<\/td>\n<\/tr>\n
NU@FNAL<\/td>\nDesign and production of an adapter for SAMTEC QTE80 pole connectors \u2013 Lax\u00a0<\/td>\n<\/tr>\n
NU@FNAL<\/td>\nDUNE Experiment SiPM Test System Electronics Service and Maintenance (Wire Fabrications, Electronics Repairs and Modifications) \u2013 Lax<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n

\u00a0<\/p>\n

Details of activities for Group III and V<\/span><\/h4>\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n
ALICE\u00a0<\/td>\nDevelopment board for picoTDC CERN \u2013 Baldanza, Falchieri<\/td>\n<\/tr>\n
ALICE\u00a0<\/td>\nFirmware development\/debug for TRM+DRM2 board \u2013 Falchieri<\/td>\n<\/tr>\n
ALICE\u00a0<\/td>\nDesign and implementation of the picoTDC_adapter board -Torromeo<\/td>\n<\/tr>\n
ALICE\u00a0<\/td>\nElectrical schematic design for mezzanine with LIROC ASIC interfacing signals from a 64 SiPM array with the picoTDC ASIC \u2013 Veri<\/td>\n<\/tr>\n
EIC<\/td>\nDesign and production of the flexible rigid board EIC_SIPM256, with 256 Sipm on 4 modules of 64 SiPM each \u2013 Baldanza<\/td>\n<\/tr>\n
EIC<\/td>\nSupport\/introduction of changes for the DAQ firmware for reading 6 Alcor chips \u2013 Falchieri\u00a0<\/td>\n<\/tr>\n
FAMU\u00a0<\/td>\nProduction and assembly of \u201cFast Baseline Restorer\u201d + \u201cADA4930 X GSPS VER2\u201d + ADL5565 X GSPS VER2 boards \u2013 Zuffa<\/td>\n<\/tr>\n
FOOT 2\u00a0<\/td>\nAdapter cards \u2013 Meneghini<\/td>\n<\/tr>\n
AIDAINNOVA<\/td>\nHardware\/firmware setup preparation with picoTDC card for chip performance evaluation \u2013 Falchieri<\/td>\n<\/tr>\n
ARCADIA<\/td>\n\u00a0Participation in characterization sessions of the MD3 monolithic chip with\/cosmic\/laser sources and installation of a working system with 2 chips at INFN BO \u2013 Falchieri<\/td>\n<\/tr>\n
HIDRA2<\/td>\nContribution to the hardware development of the calorimeter Falchieri\u00a0<\/td>\n<\/tr>\n
HIDRA2<\/td>\nRealization of a patch board for signals coming from SiPM and FERS board \u2013 Veri<\/td>\n<\/tr>\n
HIDRA2<\/td>\nRealization of a micropatch between SiPM and 16-pole 30AWG cable \u2013 Veri<\/td>\n<\/tr>\n
IGNITE<\/td>\nPreparation for the design of the digital part of a chip in TSMC 28 nm technology \u2013 Falchieri<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n

\u00a0<\/h4>\n

Summary of activities (other projects and service management)<\/span><\/h4>\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n\n
DIDACTICS\u00a0<\/td>\nVerilog course for two fifth graders of the ITI of Faenza (about 8 hours per class) with laboratory activities – Balbi<\/td>\n<\/tr>\n
DIDACTICS\u00a0<\/td>\n24-hour module in the “Applied electronics” course for the master’s degree in Physics – Falchieri<\/td>\n<\/tr>\n
DIDACTICS\u00a0<\/td>\n8-hour module in the “Laboratory of data acquisition and data processing” course for the master’s degree in Physics-\u00a0 Falchieri<\/td>\n<\/tr>\n
DIDACTICS\u00a0<\/td>\nRenovation of the northern lights simulator – Lolli<\/td>\n<\/tr>\n
TRAINING\u00a0<\/td>\nINFN Training Course on Machine Learning Techniques With FPGA Devices for Particle Physics Experiments \u2013 Travaglini<\/td>\n<\/tr>\n
MICROELECTRONICS\u00a0<\/td>\nStudy and maintenance of CAD licenses – Falchieri, Balbi, Veri<\/td>\n<\/tr>\n
MICROELECTRONICS\u00a0<\/td>\nTraining on wire bonding techniques (in collaboration with the Silici Laboratory) – Torromeo<\/td>\n<\/tr>\n
MULTIMEDIA\u00a0<\/td>\nEvent audio\/video support.\u00a0training courses and editing and archiving of shots – Bisi, Lolli, Meneghini\u00a0<\/td>\n<\/tr>\n
SERVICE\u00a0<\/td>\nSupport for licenses – Bisi<\/td>\n<\/tr>\n
SERVICE\u00a0<\/td>\nRDA for the purchase of electronic consumables and inventories for the various experiments of the INFN section of Bologna \u2013 Lax, Zuffa<\/td>\n<\/tr>\n
SERVICE\u00a0<\/td>\nSupport for the disassembly of the vacuum chamber for moving the Lolli facility<\/td>\n<\/tr>\n
SERVICE\u00a0<\/td>\nInstrument Management All<\/td>\n<\/tr>\n
SERVICE\u00a0<\/td>\nPCB creation through the service prototyping laboratory and assembly of the various electronic boards (8 in total) \u2013 Zuffa<\/td>\n<\/tr>\n
VARIOUS\u00a0<\/td>\nTest of commercial FPGA accelerator cards development of the platform for future applications on INFNcloud (in collaboration with the Calculation and Networks service) \u2013 Travaglini<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n

\u00a0<\/p>\n\n\n\n

<\/p>\n","protected":false},"excerpt":{"rendered":"

Report of the activities of the Bologna Electronics Center presented to the Section assembly – July 2023 \u00a0 Details of activities for Group I ATLAS\u00a0 Preparation of additional bases for LUCID photomultipliers \u2013 Avoni ATLAS\u00a0 Preparation of low and high voltage multipolar cabling, 35 meters long, for interconnection between the control\/acquisition rack and the ATLAS-AFP […]<\/p>\n","protected":false},"author":28,"featured_media":0,"parent":0,"menu_order":0,"comment_status":"closed","ping_status":"closed","template":"template-page-builder-no-sidebar.php","meta":{"_lmt_disableupdate":"no","_lmt_disable":"","footnotes":""},"class_list":["post-39936","page","type-page","status-publish","hentry"],"_links":{"self":[{"href":"\/elettronica\/wp-json\/wp\/v2\/pages\/39936","targetHints":{"allow":["GET"]}}],"collection":[{"href":"\/elettronica\/wp-json\/wp\/v2\/pages"}],"about":[{"href":"\/elettronica\/wp-json\/wp\/v2\/types\/page"}],"author":[{"embeddable":true,"href":"\/elettronica\/wp-json\/wp\/v2\/users\/28"}],"replies":[{"embeddable":true,"href":"\/elettronica\/wp-json\/wp\/v2\/comments?post=39936"}],"version-history":[{"count":9,"href":"\/elettronica\/wp-json\/wp\/v2\/pages\/39936\/revisions"}],"predecessor-version":[{"id":39954,"href":"\/elettronica\/wp-json\/wp\/v2\/pages\/39936\/revisions\/39954"}],"wp:attachment":[{"href":"\/elettronica\/wp-json\/wp\/v2\/media?parent=39936"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}