{"id":39969,"date":"2023-08-04T10:29:53","date_gmt":"2023-08-04T08:29:53","guid":{"rendered":"\/elettronica\/?page_id=39969"},"modified":"2023-08-04T10:34:48","modified_gmt":"2023-08-04T08:34:48","slug":"projects-2023","status":"publish","type":"page","link":"\/elettronica\/en\/projects-2023\/","title":{"rendered":"Projects-2023"},"content":{"rendered":"\n<h3 style=\"text-align: center\">Some Realizations of the Bologna Electronics Center &#8211; 2023<\/h3>\n<p>\u00a0<\/p>\n<p>\u00a0<\/p>\n<p><img loading=\"lazy\" decoding=\"async\" class=\"aligncenter wp-image-39807 size-full\" title=\"EIC SIPM256 PCB flex per EIC\" src=\"\/elettronica\/wp-content\/uploads\/sites\/14\/2023\/08\/EIC-SIPM256-PCB-flex-per-EIC.jpg\" alt=\"EIC SIPM256 PCB flex per EIC\" width=\"450\" height=\"300\" srcset=\"\/elettronica\/wp-content\/uploads\/sites\/14\/2023\/08\/EIC-SIPM256-PCB-flex-per-EIC.jpg 450w, \/elettronica\/wp-content\/uploads\/sites\/14\/2023\/08\/EIC-SIPM256-PCB-flex-per-EIC-300x200.jpg 300w\" sizes=\"auto, (max-width: 450px) 100vw, 450px\" \/><\/p>\n<h4 style=\"text-align: center\"><span style=\"color: #007bb3\">EIC SIPM256 Flex PCB for EIC<\/span><\/h4>\n<p>\u00a0<\/p>\n<ul>\n<li><span><span>256 Sipm on 4 modules of 64 SiPM each (ten layer PCB, four layers on flex, 256 controlled impedance tracks on flex)<\/span><\/span><\/li>\n<\/ul>\n<p>\u00a0<\/p>\n<p>\u00a0<\/p>\n<hr \/>\n<p><br \/><img loading=\"lazy\" decoding=\"async\" class=\"wp-image-39810 size-full aligncenter\" title=\"Sensor PCB V3\" src=\"\/elettronica\/wp-content\/uploads\/sites\/14\/2023\/08\/Sensor-PCB-V3.jpg\" alt=\"Sensor PCB V3\" width=\"450\" height=\"300\" srcset=\"\/elettronica\/wp-content\/uploads\/sites\/14\/2023\/08\/Sensor-PCB-V3.jpg 450w, \/elettronica\/wp-content\/uploads\/sites\/14\/2023\/08\/Sensor-PCB-V3-300x200.jpg 300w\" sizes=\"auto, (max-width: 450px) 100vw, 450px\" \/><\/p>\n<h4 style=\"text-align: center\"><span style=\"color: #007bb3\">Sensor PCB V3\u00a0<\/span><\/h4>\n<ul>\n<li><span><span>Design of the \u201cSensor PCB V3\u201d boards for the sapphire sensors of the Luxe experiment \u2013<\/span><\/span><br \/><span><span>\u200b\u200b70 um track thickness and 100 um vias isolation<\/span><\/span><\/li>\n<\/ul>\n<p>\u00a0<\/p>\n<hr \/>\n<p>\u00a0<\/p>\n<p><img loading=\"lazy\" decoding=\"async\" class=\"aligncenter wp-image-39815 size-full\" title=\"Schede Front end due canali per SIPM\" src=\"\/elettronica\/wp-content\/uploads\/sites\/14\/2023\/08\/schede-Front-end-due-canali-per-SIPM.jpg\" alt=\"Schede Front end due canali per SIPM\" width=\"450\" height=\"300\" srcset=\"\/elettronica\/wp-content\/uploads\/sites\/14\/2023\/08\/schede-Front-end-due-canali-per-SIPM.jpg 450w, \/elettronica\/wp-content\/uploads\/sites\/14\/2023\/08\/schede-Front-end-due-canali-per-SIPM-300x200.jpg 300w\" sizes=\"auto, (max-width: 450px) 100vw, 450px\" \/><\/p>\n<h4 style=\"text-align: center\"><span style=\"color: #007bb3\">Front end cards two channels for SIPM<\/span><\/h4>\n<p>\u00a0<\/p>\n<ul>\n<li><span><span>270 dual channel front-end boards for the Nu@FNA SIPM test system<\/span><\/span><\/li>\n<\/ul>\n<p>\u00a0<\/p>\n<p>\u00a0<\/p>\n<hr \/>\n<p><br \/><img loading=\"lazy\" decoding=\"async\" class=\"aligncenter wp-image-39821 size-full\" title=\"Micropatch tra SiPM e cavo 16 poli per HIDRA2\" src=\"\/elettronica\/wp-content\/uploads\/sites\/14\/2023\/08\/micropatch-tra-SiPM-e-cavo-16-poli-per-HIDRA2.jpg\" alt=\"Micropatch tra SiPM e cavo 16 poli per HIDRA2\" width=\"450\" height=\"300\" srcset=\"\/elettronica\/wp-content\/uploads\/sites\/14\/2023\/08\/micropatch-tra-SiPM-e-cavo-16-poli-per-HIDRA2.jpg 450w, \/elettronica\/wp-content\/uploads\/sites\/14\/2023\/08\/micropatch-tra-SiPM-e-cavo-16-poli-per-HIDRA2-300x200.jpg 300w\" sizes=\"auto, (max-width: 450px) 100vw, 450px\" \/><\/p>\n<h4 style=\"text-align: center\"><span style=\"color: #007bb3\">Micropatch between SiPM and 16 pole cable for HIDRA2<\/span><\/h4>\n<p>\u00a0<\/p>\n<ul>\n<li><span><span>Making a micropatch between SiPM and 16-pole 30 AWG cable for HIDRA2<\/span><\/span><\/li>\n<\/ul>\n<p>\u00a0<\/p>\n<hr \/>\n<p><br \/><img loading=\"lazy\" decoding=\"async\" class=\"aligncenter wp-image-39824 size-full\" title=\"scheda di conversione segnali nim TTL-LVDS\" src=\"\/elettronica\/wp-content\/uploads\/sites\/14\/2023\/08\/scheda-di-conversione-segnali-nim-TTL-LVDS-02.jpg\" alt=\"scheda di conversione segnali nim TTL-LVDS\" width=\"450\" height=\"300\" srcset=\"\/elettronica\/wp-content\/uploads\/sites\/14\/2023\/08\/scheda-di-conversione-segnali-nim-TTL-LVDS-02.jpg 450w, \/elettronica\/wp-content\/uploads\/sites\/14\/2023\/08\/scheda-di-conversione-segnali-nim-TTL-LVDS-02-300x200.jpg 300w\" sizes=\"auto, (max-width: 450px) 100vw, 450px\" \/><\/p>\n<p><br \/><img loading=\"lazy\" decoding=\"async\" class=\"aligncenter wp-image-39829 size-full\" title=\"scheda di conversione segnali nim TTL-LVDS\" src=\"\/elettronica\/wp-content\/uploads\/sites\/14\/2023\/08\/scheda-di-conversione-segnali-nim-TTL-LVDS-01.jpg\" alt=\"scheda di conversione segnali nim TTL-LVDS\" width=\"450\" height=\"300\" srcset=\"\/elettronica\/wp-content\/uploads\/sites\/14\/2023\/08\/scheda-di-conversione-segnali-nim-TTL-LVDS-01.jpg 450w, \/elettronica\/wp-content\/uploads\/sites\/14\/2023\/08\/scheda-di-conversione-segnali-nim-TTL-LVDS-01-300x200.jpg 300w\" sizes=\"auto, (max-width: 450px) 100vw, 450px\" \/><\/p>\n<p>\u00a0<\/p>\n<h4 style=\"text-align: center\"><span style=\"color: #007bb3\">TTL-LVDS nim signal conversion card<\/span><\/h4>\n<h4 style=\"text-align: center\">\u00a0<\/h4>\n<ul>\n<li><span><span>Design, assembly and test of the second version of the NIM \u2013 TTL \u2013 LVDS signal conversion board<\/span><\/span><\/li>\n<\/ul>\n<p>\u00a0<\/p>\n<p>\u00a0<\/p>\n","protected":false},"excerpt":{"rendered":"<p>Some Realizations of the Bologna Electronics Center &#8211; 2023 \u00a0 \u00a0 EIC SIPM256 Flex PCB for EIC \u00a0 256 Sipm on 4 modules of 64 SiPM each (ten layer PCB, four layers on flex, 256 controlled impedance tracks on flex) \u00a0 \u00a0 Sensor PCB V3\u00a0 Design of the \u201cSensor PCB V3\u201d boards for the sapphire [&hellip;]<\/p>\n","protected":false},"author":28,"featured_media":0,"parent":0,"menu_order":0,"comment_status":"closed","ping_status":"closed","template":"template-page-builder-no-sidebar.php","meta":{"_lmt_disableupdate":"no","_lmt_disable":"","footnotes":""},"class_list":["post-39969","page","type-page","status-publish","hentry"],"_links":{"self":[{"href":"\/elettronica\/wp-json\/wp\/v2\/pages\/39969","targetHints":{"allow":["GET"]}}],"collection":[{"href":"\/elettronica\/wp-json\/wp\/v2\/pages"}],"about":[{"href":"\/elettronica\/wp-json\/wp\/v2\/types\/page"}],"author":[{"embeddable":true,"href":"\/elettronica\/wp-json\/wp\/v2\/users\/28"}],"replies":[{"embeddable":true,"href":"\/elettronica\/wp-json\/wp\/v2\/comments?post=39969"}],"version-history":[{"count":5,"href":"\/elettronica\/wp-json\/wp\/v2\/pages\/39969\/revisions"}],"predecessor-version":[{"id":39977,"href":"\/elettronica\/wp-json\/wp\/v2\/pages\/39969\/revisions\/39977"}],"wp:attachment":[{"href":"\/elettronica\/wp-json\/wp\/v2\/media?parent=39969"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}