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Some activities of the Bologna 2022 Electronics Center

 

 

Wire bonding tests on ASIC

“Wire bonding tests on ASIC

Test with the vacuum chamber of the Section of the PRT2 boards for Limadou-2

Test with the vacuum chamber of the Section of the PRT2 boards for Limadou-2

Firmware development for MD1 + MD2 chip readout for ARCADIA

Firmware development for MD1 + MD2 chip readout for ARCADIA

 

Upgrade of the connections of the tracer previously made for the Nessie experiment

Upgrade of the connections of the tracer previously made for the Nessie experiment

 

Production of the SND_SIPM60 board and installation for SND @ LHC

Production of the SND_SIPM60 board and installation for SND @ LHC

 

Support for the integration and testing of the WWRS Base Module for ARCA-KM3

Support for the integration and testing of the WWRS Base Module for ARCA-KM3

 

 

Participation in the working group for the design and verification of the Arcadia-MD3 chip in LFoundry 110 nm technology

Participation in the working group for the design and verification of the Arcadia-MD3 chip in LFoundry 110 nm technology

 

Development of a custom ASIC for μRWELL detector in 65 or 130 nm

Development of a custom ASIC for μRWELL detector in 65 or 130 nm

Development of a custom ASIC for μRWELL detector in 65 or 130 nm

 

Microelettronica - Virtuoso schematic editor

Microelettronica – Virtuoso schematic editor

Microelettronica - Virtuoso Simulator - Spectre

Microelettronica – Virtuoso Simulator – Spectre

Microelettronica - Virtuoso Layout Suite

Virtuoso Layout Suite