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Some Realizations of the Bologna Electronics Center – 2023

 

 

EIC SIPM256 PCB flex per EIC

EIC SIPM256 Flex PCB for EIC

 

  • 256 Sipm on 4 modules of 64 SiPM each (ten layer PCB, four layers on flex, 256 controlled impedance tracks on flex)

 

 


Sensor PCB V3

Sensor PCB V3 

  • Design of the “Sensor PCB V3” boards for the sapphire sensors of the Luxe experiment –
    ​​70 um track thickness and 100 um vias isolation

 

 

Schede Front end due canali per SIPM

Front end cards two channels for SIPM

 

  • 270 dual channel front-end boards for the Nu@FNA SIPM test system

 

 


Micropatch tra SiPM e cavo 16 poli per HIDRA2

Micropatch between SiPM and 16 pole cable for HIDRA2

 

  • Making a micropatch between SiPM and 16-pole 30 AWG cable for HIDRA2

 


scheda di conversione segnali nim TTL-LVDS


scheda di conversione segnali nim TTL-LVDS

 

TTL-LVDS nim signal conversion card

 

  • Design, assembly and test of the second version of the NIM – TTL – LVDS signal conversion board